European Symp. on Reliability of Electron Devices, Failure Physics and Analysis

›8:00 (40min)

Invited Paper : Destruction Failure Analysis and International Reliability Test Standard for Power Devices
Takashi SETOYA, Toshiba Corp (Japan)

›8:00 (1h20)

European FIB User Group (EFUG)

›8:00 (2h)

Quality and Reliability Assessment – Techniques and Methods for Devices and Systems

›8:40 (1h40)

Power Devices Smart-power devices, IGBT, thyristors, High voltage devices, Thermal management

›9:20 (40min)

Invited Paper : Plasma FIB development for 3D IC structures investigations and X-ray tomography sample preparation
Guillaume AUDOIT, CEA-LETI (France)

›10:20 (40min)

Author's corner & Coffee break

›11:00 (1h40)

Tutorial : Integrated Vehicle Health Management (IVHM) for Aircraft Electronics/Power Electronics
Suresh PERINPANAYAGAM, Cranfield University, Integrated Vehicle Health Management (IVHM) Centre

›11:00 (1h40)

Power Devices Smart-power devices, IGBT, thyristors, High voltage devices, Thermal management

›11:00 (1h40)

Workshop : EFUG

›12:40 (20min)

Buffet & Author's Corner

›13:00 (2h20)

Buffet & Posters

›13:00 (2h20)

Power Devices Smart-power devices, IGBT, thyristors, High voltage devices, Thermal management
Poster session

›13:00 (2h20)

European FIB User Group (EFUG)
Poster session

›13:00 (2h20)

Quality and Reliability Assessment – Techniques and Methods for Devices and Systems
Poster session

›15:20 (40min)

Invited Paper : Modelling the impact of refinishing processes on COTS components for use in aerospace applications
Christopher Bailey, University of Greenwich

›15:20 (2h20)

Si Technologies & Nanoelectronics: Low K, Cu Interconnects

›15:20 (2h20)

Workshop : EFUG

›16:00 (1h40)

Quality and Reliability Assessment – Techniques and Methods for Devices and Systems

›17:40 (40min)

Closing Ceremony