Planning
| Time |
Event |
(+)
|
|
09:00 - 12:20
|
Lab Tours - CNES / Thales /Intraspec / Elemca / LAAS |
|
|
11:00 - 12:00
|
Registration - registration |
|
|
13:00 - 14:00
|
Registration - registration |
|
|
14:00 - 14:20
|
ESREF - General Introduction |
|
|
14:20 - 15:20
|
Keynote : ChemCam instrument on the Curiosity rover: from R&D to operations on Mars ; be reliable or die… - Sylvestre MAURICE, IRAP (France) |
|
|
15:20 - 15:40
|
Exhibition Introduction |
|
|
15:40 - 16:20
|
Exhibition & Coffee Break |
|
|
16:20 - 17:20
|
Keynote : Towards Hardware Cyber security - Ramesh KARRI, Polytechnic Institute of New York University (USA) |
|
|
17:20 - 18:40
|
Exchange Papers IRPS / IPFA / ISTFA |
|
|
18:40 - 22:00
|
Posters & Cocktail-Buffet & Exhibition - Posters & Cocktail-Buffet & Exhibition |
|
| Time |
Event |
(+)
|
|
08:00 - 08:40
|
Invited paper - EOBT: from past to future - Ludwig Balk, Univ. Wuppertal (Germany) |
|
|
08:00 - 09:20
|
Workshop : Advanced tools and techniques flash presentations |
|
|
08:00 - 09:40
|
Packages & Assembly (Room TBD) |
|
|
08:40 - 09:40
|
Failure Analysis |
|
|
09:00 - 10:20
|
Space, Aeronautic and Embedded Systems (Room TBD) - André Durier, Sonia Ben Dhia |
|
|
09:20 - 10:20
|
Tutorial : MEMS Failure modes, FA and reliability challenges (Room TBD) - Jérémie DHENNIN, Elemca (F) |
|
|
09:40 - 10:20
|
Invited Paper : Electromigration, still a reality for 3D ICs ? - Stéphane MOREAU, CEA-LETI (F) |
|
|
09:40 - 10:20
|
Workshop : Advanced tools and techniques flash presentations |
|
|
10:20 - 10:40
|
Author's Corner & Coffee break |
|
|
10:40 - 12:00
|
Workshop : Research Student Speed Dating |
|
|
11:00 - 12:00
|
Tutorial : Minimizing Defects by Design for Soldering (Room TBD) - Thomas AHRENS, TrainAlytics GmbH (Germany) |
|
|
12:00 - 12:20
|
Buffet & Author's Corner |
|
|
12:20 - 13:20
|
Buffet & Posters |
|
|
12:20 - 13:20
|
Photonic Devices - Poster session |
|
|
12:20 - 13:20
|
Photovoltaic & Organic Devices - Poster session |
|
|
12:20 - 13:20
|
Space, Aeronautic and Embedded Systems - Poster session |
|
|
12:20 - 13:20
|
Si Technologies & Nanoelectronics: Hot carriers, high K, gate materials - Poster session |
|
|
12:20 - 13:20
|
Si Technologies & Nanoelectronics: Low K, Cu Interconnects - Poster session |
|
|
13:20 - 15:40
|
Workshop - Modeling the reliability at system Level: tools and methodologies |
|
|
13:20 - 14:00
|
Invited paper: A unified multiple stress reliability model for microelectronic devices – Application to 1.55 µm DFB laser diode module for space validation. - Alain Bensoussan, Ephraim Suhir, Phil Henderson and Mustapha Zahir |
|
|
13:20 - 14:00
|
Packages & Assembly (Room TBD) |
|
|
14:00 - 15:40
|
Photonic Devices (Room TBD) |
|
|
14:00 - 15:40
|
Tutorial : Avoiding Flex Cracks in Ceramic Capacitors (CerCaps): Analytical Tool for a Reliable Failure Analysis and Guidance for Positioning CerCaps on PCBs (Room TBD) - Gert VOGEL, SIEMENS AG (Germany) |
|
|
15:40 - 16:20
|
Author's Corner & Coffee break |
|
|
16:20 - 17:00
|
Tutorial : Radiation effects on components at space level (Room TBD) - Robert ECOFFET (CNES) |
|
|
16:20 - 18:00
|
Photovoltaic & Organic Devices (Room TBD) |
|
|
16:20 - 18:00
|
Workshop : Advanced tools and techniques flash presentations |
|
|
16:20 - 18:00
|
MEMS, MOEMS, NEMS & Nano-objects (Room TBD) |
|
|
17:00 - 17:40
|
Tutorial : Radiation and COTS at ground level (Room TBD) - Jean-Luc AUTRAN, Université Marseille (F) |
|
|
18:30 - 19:30
|
Welcome cocktail at Toulouse City Hall |
|
Wednesday, October 7, 2015
| Time |
Event |
(+)
|
|
08:00 - 08:40
|
Invited Paper : EOBT: from past to future - Ludwig BALK, University of Wuppertal, Germany |
|
|
08:00 - 09:40
|
Failure Analysis |
|
|
08:00 - 09:40
|
Photonic Devices |
|
|
08:00 - 10:20
|
Workshop : Round table OEMs vs components providers |
|
|
08:40 - 10:20
|
Si Technologies & Nanoelectronics: Hot carriers, high K, gate materials |
|
|
09:40 - 10:20
|
Invited Paper : Failure analysis of photonic devices by high resolution cathodoluminescence - David GACHET, Attolight AG – Switzerland |
|
|
09:40 - 10:20
|
Advanced tools and techniques flash presentations |
|
|
10:20 - 11:00
|
Author's corner & Coffee break |
|
|
11:00 - 11:40
|
Invited Paper : Impacts of plasma process-induced damage on MOSFET parameter variability and reliability - Koji ERIGUCHI, Univ. of Kyoto (Japan) |
|
|
11:00 - 12:20
|
Failure Analysis |
|
|
11:00 - 12:20
|
Microwave and Power Wide Bandgap Devices |
|
|
11:00 - 12:20
|
Workshop : DSM Technology impact on safety assessment |
|
|
11:40 - 12:20
|
Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects |
|
|
12:20 - 12:40
|
Buffet & Author's Corner |
|
|
12:40 - 14:20
|
Buffet & Posters |
|
|
12:40 - 14:20
|
Failure Analysis - Poster session |
|
|
12:40 - 14:20
|
Microwave and Power Wide Bandgap Devices - Poster session |
|
|
14:20 - 15:00
|
Invited Paper : Vertical Power Devices Based on Bulk GaN Substrates: high field related issues - Isik KIZILYALLI, AVOGY – USA |
|
|
14:20 - 16:00
|
Tutorial : FA (=Failure Analysis and Anamnesis) and reliability at system level - Peter JACOB, EMPA Duebendorf (Switzerland) |
|
|
14:20 - 16:00
|
Quality and Reliability Assessment – Techniques and Methods for Devices and Systems |
|
|
14:20 - 16:00
|
Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects |
|
|
15:00 - 16:00
|
Microwave and Power Wide Bandgap Devices |
|
|
16:00 - 16:40
|
Author's Corner & Coffee break |
|
|
16:40 - 18:20
|
Tutorial : Mission profile and reliability on power electronics - Prof. Ke Ma and Prof. Huai WANG, Aalborg University Peter de PLACE RIMMEN, Danfoss Power Electronics |
|
|
16:40 - 17:20
|
Quality and Reliability Assessment – Techniques and Methods for Devices and Systems |
|
|
16:40 - 17:40
|
Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects |
|
|
16:40 - 18:20
|
Workshop : EUFANET : “FA at (sub)system level |
|
|
17:20 - 18:20
|
Workshop : Advanced tools and techniques "Reliability & material characterization" |
|
|
19:00 - 23:30
|
Gala Dinner |
|
Thursday, October 8, 2015
| Time |
Event |
(+)
|
|
08:00 - 08:40
|
Invited Paper : Destruction Failure Analysis and International Reliability Test Standard for Power Devices - Takashi SETOYA, Toshiba Corp (Japan) |
|
|
08:00 - 09:20
|
European FIB User Group (EFUG) |
|
|
08:00 - 10:00
|
Quality and Reliability Assessment – Techniques and Methods for Devices and Systems |
|
|
08:40 - 10:20
|
Power Devices Smart-power devices, IGBT, thyristors, High voltage devices, Thermal management |
|
|
09:20 - 10:00
|
Invited Paper : Plasma FIB development for 3D IC structures investigations and X-ray tomography sample preparation - Guillaume AUDOIT, CEA-LETI (France) |
|
|
10:20 - 11:00
|
Author's corner & Coffee break |
|
|
11:00 - 12:40
|
Tutorial : Integrated Vehicle Health Management (IVHM) for Aircraft Electronics/Power Electronics - Suresh PERINPANAYAGAM, Cranfield University, Integrated Vehicle Health Management (IVHM) Centre |
|
|
11:00 - 12:40
|
Power Devices Smart-power devices, IGBT, thyristors, High voltage devices, Thermal management |
|
|
11:00 - 12:40
|
Workshop : EFUG |
|
|
12:40 - 13:00
|
Buffet & Author's Corner |
|
|
13:00 - 15:20
|
Buffet & Posters |
|
|
13:00 - 15:20
|
Power Devices Smart-power devices, IGBT, thyristors, High voltage devices, Thermal management - Poster session |
|
|
13:00 - 15:20
|
European FIB User Group (EFUG) - Poster session |
|
|
13:00 - 15:20
|
Quality and Reliability Assessment – Techniques and Methods for Devices and Systems - Poster session |
|
|
15:20 - 16:00
|
Invited Paper : Modelling the impact of refinishing processes on COTS components for use in aerospace applications - Christopher Bailey, University of Greenwich |
|
|
15:20 - 17:40
|
Si Technologies & Nanoelectronics: Low K, Cu Interconnects |
|
|
15:20 - 17:40
|
Workshop : EFUG |
|
|
16:00 - 17:40
|
Quality and Reliability Assessment – Techniques and Methods for Devices and Systems |
|
|
17:40 - 18:20
|
Closing Ceremony |
|
| Time |
Event |
(+)
|
|
08:30 - 10:30
|
Workshop : ECPE (power): “Reliability of avionics power electronics” |
|
|
08:30 - 10:30
|
Workshop : Design for Reliability |
|
|
10:30 - 10:50
|
Coffee break |
|
|
10:50 - 12:30
|
Workshop : ECPE (power): “Reliability of avionics power electronics” |
|
|
10:50 - 12:30
|
Workshop : Design for Reliability |
|
|
13:40 - 17:00
|
Industry Tours - Airbus A380 / Continental / Freescale … |
|
|
