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Mon. 05
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List
‹
Wednesday, October 7, 2015
›
08:00
09:00
10:00
11:00
12:00
13:00
14:00
15:00
16:00
17:00
18:00
19:00
20:00
21:00
22:00
23:00
›8:00 (40min)
Invited Paper : EOBT: from past to future
Ludwig BALK, University of Wuppertal, Germany
8:00 - 8:40 (40min)
Invited Paper : EOBT: from past to future
Ludwig BALK, University of Wuppertal, Germany
›8:00 (1h40)
Failure Analysis
8:00 - 9:40 (1h40)
Failure Analysis
›8:00 (1h40)
Photonic Devices
8:00 - 9:40 (1h40)
Photonic Devices
›8:00 (2h20)
Workshop : Round table OEMs vs components providers
8:00 - 10:20 (2h20)
Workshop : Round table OEMs vs components providers
›8:40 (1h40)
Si Technologies & Nanoelectronics: Hot carriers, high K, gate materials
8:40 - 10:20 (1h40)
Si Technologies & Nanoelectronics: Hot carriers, high K, gate materials
›9:40 (40min)
Invited Paper : Failure analysis of photonic devices by high resolution cathodoluminescence
David GACHET, Attolight AG – Switzerland
9:40 - 10:20 (40min)
Invited Paper : Failure analysis of photonic devices by high resolution cathodoluminescence
David GACHET, Attolight AG – Switzerland
›9:40 (40min)
Advanced tools and techniques flash presentations
9:40 - 10:20 (40min)
Advanced tools and techniques flash presentations
›10:20 (40min)
Author's corner & Coffee break
10:20 - 11:00 (40min)
Author's corner & Coffee break
›11:00 (40min)
Invited Paper : Impacts of plasma process-induced damage on MOSFET parameter variability and reliability
Koji ERIGUCHI, Univ. of Kyoto (Japan)
11:00 - 11:40 (40min)
Invited Paper : Impacts of plasma process-induced damage on MOSFET parameter variability and reliability
Koji ERIGUCHI, Univ. of Kyoto (Japan)
›11:00 (1h20)
Failure Analysis
11:00 - 12:20 (1h20)
Failure Analysis
›11:00 (1h20)
Microwave and Power Wide Bandgap Devices
11:00 - 12:20 (1h20)
Microwave and Power Wide Bandgap Devices
›11:00 (1h20)
Workshop : DSM Technology impact on safety assessment
11:00 - 12:20 (1h20)
Workshop : DSM Technology impact on safety assessment
›11:40 (40min)
Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects
11:40 - 12:20 (40min)
Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects
›12:20 (20min)
Buffet & Author's Corner
12:20 - 12:40 (20min)
Buffet & Author's Corner
›12:40 (1h40)
Buffet & Posters
12:40 - 14:20 (1h40)
Buffet & Posters
›12:40 (1h40)
Failure Analysis
Poster session
12:40 - 14:20 (1h40)
Failure Analysis
Poster session
›12:40 (1h40)
Microwave and Power Wide Bandgap Devices
Poster session
12:40 - 14:20 (1h40)
Microwave and Power Wide Bandgap Devices
Poster session
›14:20 (40min)
Invited Paper : Vertical Power Devices Based on Bulk GaN Substrates: high field related issues
Isik KIZILYALLI, AVOGY – USA
14:20 - 15:00 (40min)
Invited Paper : Vertical Power Devices Based on Bulk GaN Substrates: high field related issues
Isik KIZILYALLI, AVOGY – USA
›14:20 (1h40)
Tutorial : FA (=Failure Analysis and Anamnesis) and reliability at system level
Peter JACOB, EMPA Duebendorf (Switzerland)
14:20 - 16:00 (1h40)
Tutorial : FA (=Failure Analysis and Anamnesis) and reliability at system level
Peter JACOB, EMPA Duebendorf (Switzerland)
›14:20 (1h40)
Quality and Reliability Assessment – Techniques and Methods for Devices and Systems
14:20 - 16:00 (1h40)
Quality and Reliability Assessment – Techniques and Methods for Devices and Systems
›14:20 (1h40)
Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects
14:20 - 16:00 (1h40)
Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects
›15:00 (1h)
Microwave and Power Wide Bandgap Devices
15:00 - 16:00 (1h)
Microwave and Power Wide Bandgap Devices
›16:00 (40min)
Author's Corner & Coffee break
16:00 - 16:40 (40min)
Author's Corner & Coffee break
›16:40 (1h40)
Tutorial : Mission profile and reliability on power electronics
Prof. Ke Ma and Prof. Huai WANG, Aalborg University Peter de PLACE RIMMEN, Danfoss Power Electronics
16:40 - 18:20 (1h40)
Tutorial : Mission profile and reliability on power electronics
Prof. Ke Ma and Prof. Huai WANG, Aalborg University Peter de PLACE RIMMEN, Danfoss Power Electronics
›16:40 (40min)
Quality and Reliability Assessment – Techniques and Methods for Devices and Systems
16:40 - 17:20 (40min)
Quality and Reliability Assessment – Techniques and Methods for Devices and Systems
›16:40 (1h)
Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects
16:40 - 17:40 (1h)
Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects
›16:40 (1h40)
Workshop : EUFANET : “FA at (sub)system level
16:40 - 18:20 (1h40)
Workshop : EUFANET : “FA at (sub)system level
›17:20 (1h)
Workshop : Advanced tools and techniques "Reliability & material characterization"
17:20 - 18:20 (1h)
Workshop : Advanced tools and techniques "Reliability & material characterization"
›19:00 (4h30)
Gala Dinner
19:00 - 23:30 (4h30)
Gala Dinner
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