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Monday, October 5, 2015
| Time | Event | |
| 09:00 - 12:20 | Lab Tours - CNES / Thales /Intraspec / Elemca / LAAS | |
| 11:00 - 12:00 | Registration - registration | |
| 13:00 - 14:00 | Registration - registration | |
| 14:00 - 14:20 | ESREF - General Introduction | |
| 14:20 - 15:20 | Keynote : ChemCam instrument on the Curiosity rover: from R&D to operations on Mars ; be reliable or die… - Sylvestre MAURICE, IRAP (France) | |
| 15:20 - 15:40 | Exhibition Introduction | |
| 15:40 - 16:20 | Exhibition & Coffee Break | |
| 16:20 - 17:20 | Keynote : Towards Hardware Cyber security - Ramesh KARRI, Polytechnic Institute of New York University (USA) | |
| 17:20 - 18:40 | Exchange Papers IRPS / IPFA / ISTFA | |
| 18:40 - 22:00 | Posters & Cocktail-Buffet & Exhibition - Posters & Cocktail-Buffet & Exhibition |
Tuesday, October 6, 2015
| Time | Event | |
| 08:00 - 08:40 | Invited paper - EOBT: from past to future - Ludwig Balk, Univ. Wuppertal (Germany) | |
| 08:00 - 09:20 | Workshop : Advanced tools and techniques flash presentations | |
| 08:00 - 09:40 | Packages & Assembly (Room TBD) | |
| 08:40 - 09:40 | Failure Analysis | |
| 09:00 - 10:20 | Space, Aeronautic and Embedded Systems (Room TBD) - André Durier, Sonia Ben Dhia | |
| 09:20 - 10:20 | Tutorial : MEMS Failure modes, FA and reliability challenges (Room TBD) - Jérémie DHENNIN, Elemca (F) | |
| 09:40 - 10:20 | Invited Paper : Electromigration, still a reality for 3D ICs ? - Stéphane MOREAU, CEA-LETI (F) | |
| 09:40 - 10:20 | Workshop : Advanced tools and techniques flash presentations | |
| 10:20 - 10:40 | Author's Corner & Coffee break | |
| 10:40 - 12:00 | Workshop : Research Student Speed Dating | |
| 11:00 - 12:00 | Tutorial : Minimizing Defects by Design for Soldering (Room TBD) - Thomas AHRENS, TrainAlytics GmbH (Germany) | |
| 12:00 - 12:20 | Buffet & Author's Corner | |
| 12:20 - 13:20 | Buffet & Posters | |
| 12:20 - 13:20 | Photonic Devices - Poster session | |
| 12:20 - 13:20 | Photovoltaic & Organic Devices - Poster session | |
| 12:20 - 13:20 | Space, Aeronautic and Embedded Systems - Poster session | |
| 12:20 - 13:20 | Si Technologies & Nanoelectronics: Hot carriers, high K, gate materials - Poster session | |
| 12:20 - 13:20 | Si Technologies & Nanoelectronics: Low K, Cu Interconnects - Poster session | |
| 13:20 - 15:40 | Workshop - Modeling the reliability at system Level: tools and methodologies | |
| 13:20 - 14:00 | Invited paper: A unified multiple stress reliability model for microelectronic devices – Application to 1.55 µm DFB laser diode module for space validation. - Alain Bensoussan, Ephraim Suhir, Phil Henderson and Mustapha Zahir | |
| 13:20 - 14:00 | Packages & Assembly (Room TBD) | |
| 14:00 - 15:40 | Photonic Devices (Room TBD) | |
| 14:00 - 15:40 | Tutorial : Avoiding Flex Cracks in Ceramic Capacitors (CerCaps): Analytical Tool for a Reliable Failure Analysis and Guidance for Positioning CerCaps on PCBs (Room TBD) - Gert VOGEL, SIEMENS AG (Germany) | |
| 15:40 - 16:20 | Author's Corner & Coffee break | |
| 16:20 - 17:00 | Tutorial : Radiation effects on components at space level (Room TBD) - Robert ECOFFET (CNES) | |
| 16:20 - 18:00 | Photovoltaic & Organic Devices (Room TBD) | |
| 16:20 - 18:00 | Workshop : Advanced tools and techniques flash presentations | |
| 16:20 - 18:00 | MEMS, MOEMS, NEMS & Nano-objects (Room TBD) | |
| 17:00 - 17:40 | Tutorial : Radiation and COTS at ground level (Room TBD) - Jean-Luc AUTRAN, Université Marseille (F) | |
| 18:30 - 19:30 | Welcome cocktail at Toulouse City Hall |
Wednesday, October 7, 2015
| Time | Event | |
| 08:00 - 08:40 | Invited Paper : EOBT: from past to future - Ludwig BALK, University of Wuppertal, Germany | |
| 08:00 - 09:40 | Failure Analysis | |
| 08:00 - 09:40 | Photonic Devices | |
| 08:00 - 10:20 | Workshop : Round table OEMs vs components providers | |
| 08:40 - 10:20 | Si Technologies & Nanoelectronics: Hot carriers, high K, gate materials | |
| 09:40 - 10:20 | Invited Paper : Failure analysis of photonic devices by high resolution cathodoluminescence - David GACHET, Attolight AG – Switzerland | |
| 09:40 - 10:20 | Advanced tools and techniques flash presentations | |
| 10:20 - 11:00 | Author's corner & Coffee break | |
| 11:00 - 11:40 | Invited Paper : Impacts of plasma process-induced damage on MOSFET parameter variability and reliability - Koji ERIGUCHI, Univ. of Kyoto (Japan) | |
| 11:00 - 12:20 | Failure Analysis | |
| 11:00 - 12:20 | Microwave and Power Wide Bandgap Devices | |
| 11:00 - 12:20 | Workshop : DSM Technology impact on safety assessment | |
| 11:40 - 12:20 | Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects | |
| 12:20 - 12:40 | Buffet & Author's Corner | |
| 12:40 - 14:20 | Buffet & Posters | |
| 12:40 - 14:20 | Failure Analysis - Poster session | |
| 12:40 - 14:20 | Microwave and Power Wide Bandgap Devices - Poster session | |
| 14:20 - 15:00 | Invited Paper : Vertical Power Devices Based on Bulk GaN Substrates: high field related issues - Isik KIZILYALLI, AVOGY – USA | |
| 14:20 - 16:00 | Tutorial : FA (=Failure Analysis and Anamnesis) and reliability at system level - Peter JACOB, EMPA Duebendorf (Switzerland) | |
| 14:20 - 16:00 | Quality and Reliability Assessment – Techniques and Methods for Devices and Systems | |
| 14:20 - 16:00 | Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects | |
| 15:00 - 16:00 | Microwave and Power Wide Bandgap Devices | |
| 16:00 - 16:40 | Author's Corner & Coffee break | |
| 16:40 - 18:20 | Tutorial : Mission profile and reliability on power electronics - Prof. Ke Ma and Prof. Huai WANG, Aalborg University Peter de PLACE RIMMEN, Danfoss Power Electronics | |
| 16:40 - 17:20 | Quality and Reliability Assessment – Techniques and Methods for Devices and Systems | |
| 16:40 - 17:40 | Si Technologies & Nanoelectronics: ESD, Latch-up, Radiation Effects | |
| 16:40 - 18:20 | Workshop : EUFANET : “FA at (sub)system level | |
| 17:20 - 18:20 | Workshop : Advanced tools and techniques "Reliability & material characterization" | |
| 19:00 - 23:30 | Gala Dinner |
Thursday, October 8, 2015
| Time | Event | |
| 08:00 - 08:40 | Invited Paper : Destruction Failure Analysis and International Reliability Test Standard for Power Devices - Takashi SETOYA, Toshiba Corp (Japan) | |
| 08:00 - 09:20 | European FIB User Group (EFUG) | |
| 08:00 - 10:00 | Quality and Reliability Assessment – Techniques and Methods for Devices and Systems | |
| 08:40 - 10:20 | Power Devices Smart-power devices, IGBT, thyristors, High voltage devices, Thermal management | |
| 09:20 - 10:00 | Invited Paper : Plasma FIB development for 3D IC structures investigations and X-ray tomography sample preparation - Guillaume AUDOIT, CEA-LETI (France) | |
| 10:20 - 11:00 | Author's corner & Coffee break | |
| 11:00 - 12:40 | Tutorial : Integrated Vehicle Health Management (IVHM) for Aircraft Electronics/Power Electronics - Suresh PERINPANAYAGAM, Cranfield University, Integrated Vehicle Health Management (IVHM) Centre | |
| 11:00 - 12:40 | Power Devices Smart-power devices, IGBT, thyristors, High voltage devices, Thermal management | |
| 11:00 - 12:40 | Workshop : EFUG | |
| 12:40 - 13:00 | Buffet & Author's Corner | |
| 13:00 - 15:20 | Buffet & Posters | |
| 13:00 - 15:20 | Power Devices Smart-power devices, IGBT, thyristors, High voltage devices, Thermal management - Poster session | |
| 13:00 - 15:20 | European FIB User Group (EFUG) - Poster session | |
| 13:00 - 15:20 | Quality and Reliability Assessment – Techniques and Methods for Devices and Systems - Poster session | |
| 15:20 - 16:00 | Invited Paper : Modelling the impact of refinishing processes on COTS components for use in aerospace applications - Christopher Bailey, University of Greenwich | |
| 15:20 - 17:40 | Si Technologies & Nanoelectronics: Low K, Cu Interconnects | |
| 15:20 - 17:40 | Workshop : EFUG | |
| 16:00 - 17:40 | Quality and Reliability Assessment – Techniques and Methods for Devices and Systems | |
| 17:40 - 18:20 | Closing Ceremony |
Friday, October 9, 2015
| Time | Event | |
| 08:30 - 10:30 | Workshop : ECPE (power): “Reliability of avionics power electronics” | |
| 08:30 - 10:30 | Workshop : Design for Reliability | |
| 10:30 - 10:50 | Coffee break | |
| 10:50 - 12:30 | Workshop : ECPE (power): “Reliability of avionics power electronics” | |
| 10:50 - 12:30 | Workshop : Design for Reliability | |
| 13:40 - 17:00 | Industry Tours - Airbus A380 / Continental / Freescale … |
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