Sister Conferences

Based on an exchange agreement with the committees of the

  • International Symposium on the Physical & Failure Analysis of Integrated Circuits Conference (IPFA 2015),
  • International Reliability Physics Symposium (IRPS 2015) and
  • International Symposium for Testing and Failure Analysis (ISTFA 2014),

authors of awarded papers have been invited to present their work at ESREF 2015. These exchanges prove the fruitful collaboration between the Committees of these three conferences.

Similarly, three ESREF2014 best papers, listed hereafter, have been invited to present their work at:

ISTFA 2015
Advanced FIB sample preparation techniques for high-resolution TEM investigations of HEMT device structures
Michél Simon-Najasek1, Frank Altmann1, Susanne Hübner1, Andreas Graff1 and Helmut Jung2
1 Fraunhofer Institute for Mechanics of Materials IWM, Germany, 2United Monolithic Semiconductors GmbH, Germany

IPFA 2015
Study of Thermal Cycling and Temperature Aging on PbSnAg Die Attach Solder Joints for High Power Modules
Franc Dugal 1, Mauro Ciappa 2
1 ABB, Switzerland, 2 ETH Zurich, Switzerland

IRPS 2015
HCS Degradation of 5nm Oxide High-Voltage PLDMOS
Christina Olk, Stefano Aresu, Ralf Rudolf, Michael Röhner, Wolfgang Gustin
Infineon, Germany

 

ISTFA 2015 VIDEO CONTEST

Enter to win the International Symposium for Testing and Failure Analysis (ISTFA) 2015 Video Contest by submitting your 3 minute (or less) video about an exciting result or artifact - anything goes as long as it relates to electronic device failure analysis! Submit your MPEG or AVI video, max size 50MB, by October 2nd. Audio and subtitles are allowed, and a short description should also be submitted along with all of your complete contact information. Winners will be recognized at this year’s ISTFA, which is taking place in Portland, OR, USA on November 1-5, 2015. The grand prize for the contest is $50, a complimentary registration to a future ISTFA conference, and a 1st place plaque. Lights, camera... ANALYSIS! 

Last year’s winning submission:

Video submission deadline: October 2, 2015
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