Sub-committee Chairs |
|
Topic A: Quality and Reliability Assessment – Techniques and Methods for Devices and Systems |
Ninoslav D. STOJADINOVIC |
University of Nis (Serbia) |
Bruno FOUCHER |
AIRBUS GROUP INNOVATIONS (France) |
|
Topic B1: Si-Technologies & Nanoelectronics: Hot carriers, high K, gate materials |
Alain BRAVAIX |
ISEN-IM2PN (France) |
Jim STATHIS |
IBM Research (USA) |
|
Topic B2: Si-Technologies & Nanoelectronics: Low K, Cu Interconnects |
Hervé JAOUEN |
STMicroelectronics (France) |
Eckhard LANGER |
Globalfoundries (Germany) |
|
Topic B3: Si-Technologies & Nanoelectronics: ESD, Latch-up, radiation effects: |
Philippe GALY |
STMicroelectronics (France) |
Fabrice CAIGNET |
LAAS-CNRS (France) |
Vesselin VASSILEV |
(NOVORELL Technologies - USA) |
|
Topic C: Failure Analysis |
Ralf HEIDERHOFF |
Bergische Universität Wuppertal (Germany) |
Olivier CREPEL |
AIRBUS GROUP INNOVATIONS (France) |
|
Topic D1: Microwave and Power Wide Band-gap Devices |
Gaudenzio MENEGHESSO |
University of Padova (Italy) |
Nathalie LABAT |
IMS, University Bordeaux (France) |
Peter FRIEDRICHS |
INFINEON - Germany |
|
Topic D2: Photonic Devices |
Massimo VANZI |
University of Cagliari (Italy) |
Matteo MENEGHINI |
University of Padova (Italy) |
|
Topic D3: Photovoltaic & Organic Devices |
Nicola WRACHIEN |
University of Padova (Italy) |
|
Topic E1: Packages & Assembly |
K. WEIDE-ZAAGE |
University of Hannover (GER) |
Geneviève DUCHAMP |
IMS, University Bordeaux (France) |
|
Topic E2: MEMS, MOEMS, NEMS & Nano-objects |
George PAPAIOANNOU |
University of Athens (Greece) |
Fabio COCCETTI |
FIALAB (France) |
|
Topic F: Power Devices |
Patrick TOUNSI |
INSA, LAAS-CNRS (France) |
Eckhard WOLFGANG |
ECPE (Germany) |
|
Topic G: Space, Aeronautic and Embedded Systems |
Sonia BEN DHIA |
INSA, LAAS-CNRS (F) |
Fabian Vargas |
Catholic University - PUCRS (Brazil) |
André DURIER |
IRT Saint-Exupéry (France) |
Florent MILLER |
AIRBUS GROUP INNOVATIONS (France) |
|
Topic H: European FIB User Group (EFUG) |
H. BENDER |
IMEC (BE) |
F. ALTMANN |
Fraunhofer IWM Halle (GER) |
Hélène CHAUVIN |
Thales Group (France) |