| Sub-committee Chairs |
| |
| Topic A: Quality and Reliability Assessment – Techniques and Methods for Devices and Systems |
| Ninoslav D. STOJADINOVIC |
University of Nis (Serbia) |
| Bruno FOUCHER |
AIRBUS GROUP INNOVATIONS (France) |
| |
| Topic B1: Si-Technologies & Nanoelectronics: Hot carriers, high K, gate materials |
| Alain BRAVAIX |
ISEN-IM2PN (France) |
| Jim STATHIS |
IBM Research (USA) |
| |
| Topic B2: Si-Technologies & Nanoelectronics: Low K, Cu Interconnects |
| Hervé JAOUEN |
STMicroelectronics (France) |
| Eckhard LANGER |
Globalfoundries (Germany) |
| |
| Topic B3: Si-Technologies & Nanoelectronics: ESD, Latch-up, radiation effects: |
| Philippe GALY |
STMicroelectronics (France) |
| Fabrice CAIGNET |
LAAS-CNRS (France) |
| Vesselin VASSILEV |
(NOVORELL Technologies - USA) |
| |
| Topic C: Failure Analysis |
| Ralf HEIDERHOFF |
Bergische Universität Wuppertal (Germany) |
| Olivier CREPEL |
AIRBUS GROUP INNOVATIONS (France) |
| |
| Topic D1: Microwave and Power Wide Band-gap Devices |
| Gaudenzio MENEGHESSO |
University of Padova (Italy) |
| Nathalie LABAT |
IMS, University Bordeaux (France) |
| Peter FRIEDRICHS |
INFINEON - Germany |
| |
| Topic D2: Photonic Devices |
| Massimo VANZI |
University of Cagliari (Italy) |
| Matteo MENEGHINI |
University of Padova (Italy) |
| |
| Topic D3: Photovoltaic & Organic Devices |
| Nicola WRACHIEN |
University of Padova (Italy) |
| |
| Topic E1: Packages & Assembly |
| K. WEIDE-ZAAGE |
University of Hannover (GER) |
| Geneviève DUCHAMP |
IMS, University Bordeaux (France) |
| |
| Topic E2: MEMS, MOEMS, NEMS & Nano-objects |
| George PAPAIOANNOU |
University of Athens (Greece) |
| Fabio COCCETTI |
FIALAB (France) |
| |
| Topic F: Power Devices |
| Patrick TOUNSI |
INSA, LAAS-CNRS (France) |
| Eckhard WOLFGANG |
ECPE (Germany) |
| |
| Topic G: Space, Aeronautic and Embedded Systems |
| Sonia BEN DHIA |
INSA, LAAS-CNRS (F) |
| Fabian Vargas |
Catholic University - PUCRS (Brazil) |
| André DURIER |
IRT Saint-Exupéry (France) |
| Florent MILLER |
AIRBUS GROUP INNOVATIONS (France) |
| |
| Topic H: European FIB User Group (EFUG) |
| H. BENDER |
IMEC (BE) |
| F. ALTMANN |
Fraunhofer IWM Halle (GER) |
| Hélène CHAUVIN |
Thales Group (France) |
