|
|
Author's Corner > Final SubmissionPROCEDURE FOR THE SUBMISSION OF THE FINAL MANUSCRIPT Authors of tutorials, invited and accepted papers (both oral and poster) are invited to submit a full paper for publication in the conference proceedings. Elsevier Science will publish the ESREF 2015 proceedings as a special issue of the scientific journal ”Microelectronics Reliability“. As a result the submission of the final manuscript should follow the instructions from ELSEVIER SCIENCE and is made via the Elsevier Editorial System (EES) submission portal : Once logged (if you do not have an Elsevier account, you will have to register first), to ensure that your manuscript is correctly identified for inclusion into the ESREF 2015 special issue of Microelectronics Reliability , you will have to choose the option: “SI: Proceedings ESREF 2015” in the menu Choose Article Type. (For any question regarding final submission, please contact paper@esref2015.org) Deadlines & Duties for Authors & Mentors: The official language of ESREF 2015 is English. All submitted material must be in English. 1. Authors prepare & upload full manuscript - Deadline: May 25th Name your manuscript file with your paper number: e.g. “esref2015_paper_187.doc” Paper Length Authors are advised that because all the papers will be typeset defining an exact paper length is very difficult. However because ESREF papers are limited to a 6 pages limit, the following rules apply:
2. Mentors review full manuscript - Deadline: June 6th 3. The presenting Author is requested to register at ESREF 2015 - Deadline: May 30th 4. Authors revise full manuscript & upload final manuscript - Deadline: June 20th 5. Mentor approval of final manuscript - Deadline: June 25th 6. Authors may re-submit an approved manuscript with any requested minor revision to EES submission portal. In any case, this is the end of the submission process - Deadline: June 30th 7. Proof reading - Deadline: in August |
Online user: 1 | RSS Feed |